Macchina per l'ispezione a raggi X NEODEN ND56X

parti elettriche / parti elettriche

The ND56X is designed for R&D; enterprises, laboratories, and quality inspection rooms. It is a fully automatic defect inspection system suitable for a wide range electronic components and precision parts. CE certified and compliant with SEMI S2/S8 semiconductor industry specifications. X-Ray Tube ...

Fabbricante: NEODEN

Modello:ND56X

Tipo di macchina: Macchina per l'ispezione a raggi X

Numero di articolo: 169459077

Quantità: 1

Data: 19.06.2026

Anno di fabbricazione: 2026

Luogo: Munich, Germany

Prezzo:


Seller-item-No.:8893069

The ND56X is designed for R&D; enterprises, laboratories, and quality inspection rooms. It is a fully automatic defect inspection system suitable for a wide range electronic components and precision parts. CE certified and compliant with SEMI S2/S8 semiconductor industry specifications.

X-Ray Tube Source Specifications

- Type: sealed micro-focus X-ray tube

- Voltage range: 40 to 90 kV

- Current range: 10 to 200 uA

- Maximum output power: 8 W

- Micro focus spot size: 15 um

Flat Panel Detector Specifications

- Type: TFT Industrial Dynamic Flat Panel Detector (FPD)

- Pixel matrix: 768x768 to 1536x1536

- Field of view: 65x65 to 130x130 mm

- Resolution: 5.8 Lp/mm

- Frame rate (1x1): 20 to 40 fps

- A/D conversion: 16 bits

Key Features and Functions

- Automatic defect detection: size, area, broken wire, bridging and more

- Customizable software algorithms: Y/N, crack, broken wire, offset, size, and quantity detection

- CNC automatic multi-point inspection mode with coordinate-based programming

- Automatic image saving and batch inspection report generation

- Tilt angle inspection: detector supports +/- 30 degrees tilt for multi-angle defect analysis

- 360 degree rotating manipulator for complete defect observation with no blind spots

- Enhanced BGA inspection: automatic solder ball identification and void ratio calculation

- Infrared automatic navigation and positioning for fast shooting location selection

- Comprehensive size measurement tools: distance, angle, radius, circumference and more

- LED pad measurement, sensor size measurement, THT tin ratio measurement

- Miniaturized equipment, easy to install and operate

- Long lifespan design with low operating costs

Applications

The ND56X is suitable for inspection of: Chip, LED, BGA/CSP, Wafer, SOP/QFN, SMT and PTH packaging, sensors, connectors, and precision castings.

Radiation Safety

- Radiation protection standard: less than 0.5 uSv/h (equivalent to 1/10 of natural background

radiation)

- Exemption record certified by the Ministry of Ecology and Environment of the People´s Republic

of China, record number Yuehuan [2018] No. 1688

- Triple safety protection sensor with OMRON safety control element

- Fully compliant with CE specifications and SEMI S2/S8 semiconductor industry standards

- No radiation safety license required for this product model

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The ND56X is designed for R&D; enterprises, laboratories, and quality inspection rooms. It is a fully automatic defect inspection system suitable for a wide range electronic components and precision parts. CE certified and compliant with SEMI S2/S8 semiconductor industry specifications.

X-Ray Tube Source Specifications

- Type: sealed micro-focus X-ray tube

- Voltage range: 40 to 90 kV

- Current range: 10 to 200 uA

- Maximum output power: 8 W

- Micro focus spot size: 15 um

Flat Panel Detector Specifications

- Type: TFT Industrial Dynamic Flat Panel Detector (FPD)

- Pixel matrix: 768x768 to 1536x1536

- Field of view: 65x65 to 130x130 mm

- Resolution: 5.8 Lp/mm

- Frame rate (1x1): 20 to 40 fps

- A/D conversion: 16 bits

Key Features and Functions

- Automatic defect detection: size, area, broken wire, bridging and more

- Customizable software algorithms: Y/N, crack, broken wire, offset, size, and quantity detection

- CNC automatic multi-point inspection mode with coordinate-based programming

- Automatic image saving and batch inspection report generation

- Tilt angle inspection: detector supports +/- 30 degrees tilt for multi-angle defect analysis

- 360 degree rotating manipulator for complete defect observation with no blind spots

- Enhanced BGA inspection: automatic solder ball identification and void ratio calculation

- Infrared automatic navigation and positioning for fast shooting location selection

- Comprehensive size measurement tools: distance, angle, radius, circumference and more

- LED pad measurement, sensor size measurement, THT tin ratio measurement

- Miniaturized equipment, easy to install and operate

- Long lifespan design with low operating costs

Applications

The ND56X is suitable for inspection of: Chip, LED, BGA/CSP, Wafer, SOP/QFN, SMT and PTH packaging, sensors, connectors, and precision castings.

Radiation Safety

- Radiation protection standard: less than 0.5 uSv/h (equivalent to 1/10 of natural background

radiation)

- Exemption record certified by the Ministry of Ecology and Environment of the People´s Republic

of China, record number Yuehuan [2018] No. 1688

- Triple safety protection sensor with OMRON safety control element

- Fully compliant with CE specifications and SEMI S2/S8 semiconductor industry standards

- No radiation safety license required for this product model

Find more here - /

Contact us at -
seller offer No. resale 8893069
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Venditore

logo dealer

UCY Industrial GmbH

Signor Nick Breinfalk
82049 Pullach
Germany

RESALE membro dato che 2024

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