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Viscom S3088 Ultra Sistemi AOI
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Dati tecnici
· ID 168729211Macchine
- Condizioni
- usato
- Anno di costruzione
- 2014
- Ubicazione
- Freiburg im Breisgau, Germany
Identifikation
ProduttoreViscom
ModelloS3088 Ultra
Numero articolo8523248
Technik
Quantità1
Descrizione
The Viscom S3088 ultra gold is a high-performance 3D Automated Optical Inspection (AOI) system designed for high-volume electronics manufacturing that requires maximum throughput and precision.
PCs replaced in 2024 to new ones
Top Performance Specs
- Inspection Speed: Up to 65 cm²/s, making it ideal for the highest throughput demands.
- 3D Sensor Technology: Powered by the XMplus high-performance camera module.
- Camera Configuration: Features up to 9 cameras (including orthogonal and angled views) for shadow-free 3D inspection.
- Image Field Size: $50\text{ mm} \times 50\text{ mm}$.
- Resolution: High-resolution 3D analysis down to 10 µm (orthogonal) and 0.5 µm (Z-axis).
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Key Technical Capabilities
- Component Range: Reliably inspects the latest miniaturized generations, including 03015 components.
- Defect Detection: Advanced analysis for QFN, DFN, and QFP dewetting via angled views, as well as lifted leads and polarity errors.
- FastFlow Handling: Synchronous PCB transport allows for ultra-fast board changes in as little as 2.5 seconds.
- Software & AI: Supports vVision and EasyPro for intuitive operation and rapid program generation.
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Hardware & Dimensions
FeatureSpecificationMax PCB Size$508\text{ mm} \times 508\text{ mm}$System Dimensions$997\text{ mm} \times 1600\text{ mm} \times 1540\text{ mm}$ ($B \times H \times T$)WeightMax. 800 kgPower/Air400 V; 3P/N/PE; 8 A; 4–6 bar working pressurePC SystemIntel Core i7 processor running on Windows
Find more here - .ucymachines/
Contact us at - sales@ucymachines
PCs replaced in 2024 to new ones
Top Performance Specs
- Inspection Speed: Up to 65 cm²/s, making it ideal for the highest throughput demands.
- 3D Sensor Technology: Powered by the XMplus high-performance camera module.
- Camera Configuration: Features up to 9 cameras (including orthogonal and angled views) for shadow-free 3D inspection.
- Image Field Size: $50\text{ mm} \times 50\text{ mm}$.
- Resolution: High-resolution 3D analysis down to 10 µm (orthogonal) and 0.5 µm (Z-axis).
---------------------------------------------------------------
Key Technical Capabilities
- Component Range: Reliably inspects the latest miniaturized generations, including 03015 components.
- Defect Detection: Advanced analysis for QFN, DFN, and QFP dewetting via angled views, as well as lifted leads and polarity errors.
- FastFlow Handling: Synchronous PCB transport allows for ultra-fast board changes in as little as 2.5 seconds.
- Software & AI: Supports vVision and EasyPro for intuitive operation and rapid program generation.
---------------------------------------------------------------
Hardware & Dimensions
FeatureSpecificationMax PCB Size$508\text{ mm} \times 508\text{ mm}$System Dimensions$997\text{ mm} \times 1600\text{ mm} \times 1540\text{ mm}$ ($B \times H \times T$)WeightMax. 800 kgPower/Air400 V; 3P/N/PE; 8 A; 4–6 bar working pressurePC SystemIntel Core i7 processor running on Windows
Find more here - .ucymachines/
Contact us at - sales@ucymachines
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